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Areospace Rapid Rate Temperature Change Testing Chamber JEDEC (JESD 22-A104F)

Brand Name:	Jianqiao
Model Number:	JQESS-100
MOQ:	1
Delivery Time:	5~ weeks
Payment Terms:	,T/T

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

Heating System:

Stainless Steel Tubular Heater

Cooling System:

Mechanical Refrigeration

Warranty:

1 Year

Refrigeration Compressor:

Hermetic Compressor(Tecumseh)

Humidity Uniformity:

±2.0％RH

Fan:

Centrifugal Blower

Humidifier:

Steam Humidifier

Humidity Control Range:

20.0%RH～95.0%RH

Evaporator:

Fin - And - Tube Heat Exchanger

Chamber Size:

1000mm X 1000mm X 1000mm

Humidity Control:

10% ~95%RH

Packaging Details:

Wooden case

Supply Ability:

300

Highlight:

Rapid Temperature Change Testing Chamber

Areospace Temperature Change Testing Chamber

Product Description

Rapid Rate Temperature Change Testing Chamber for Aerospace JEDEC (JESD 22-A104F)

Product Specifications

Attribute	Value
Heating System	Stainless Steel Tubular Heater
Cooling System	Mechanical Refrigeration
Warranty	1 Year
Refrigeration Compressor	Hermetic compressor (Tecumseh)
Humidity Uniformity	±2.0％RH
Fan	Centrifugal blower
Humidifier	Steam humidifier
Humidity Control Range	20.0%RH～95.0%RH
Evaporator	Fin-and-Tube Heat Exchanger
Chamber Size	1000mm x 1000mm x 1000mm
Humidity Control	10% ~95%RH

Product Overview

This Rapid Temperature Change Rate Cycling Chamber is designed for accelerated product testing and reliability assessment in aerospace applications.

Key Features

Uniform temperature distribution: Creates consistent stress across test specimens with optimized airflow patterns calculated through simulation.
Precise temperature control: High-speed controller manages test sample temperature variation rates up to 15°C/minute.
JEDEC compliance: Meets JESD22-A104F standard requirements for semiconductor package and solder junction evaluations.
Dual control modes: Supports both specimen temperature control (15°C/minute) and air temperature control for versatile testing applications.

Technical Advantages

Rapid change temperature testing addresses modern reliability challenges including higher device operation temperatures, advanced mounting methods (BGA/CSP), and lead-free solder requirements. Unlike thermal shock testing, this method provides highly repeatable results with controlled temperature variation rates ≤15°C/minute.