Rate Temperature Change Chambers With Steam Humidifier Centrifugal Blower

The temperature distribution performance is outstanding even during temperature variation, providing uniform and highly repeatable stress. The optimum air flow and air velocity distribution are calculated by simulation, minimizing differences in stress caused by specimen placement positions.

Features a high-speed controller for specimen temperature control achieved through various new technologies. Increased refrigeration capacity, advanced air-conditioning technology minimizes temperature difference between specimen and air, and uniform air velocity distribution minimizes test sample temperature variation.

The Rapid-rate Thermal Cycle Chamber enables semiconductor package evaluations and solder junction evaluations in compliance with JESD22-A104F standard, with test sample temperature control at 15℃/minute (between -40 and +125°C).

Uses two control methods enabling thermal cycling tests with specimen temperature control of 15℃/minute and air temperature control. Supports various applications from standards compliance testing to screening.